Pemtron's color 3D solder paste inspection (3D SPI) device uses the latest color algorithm to produce images like the actual PCB.
Our 3D solder paste inspection (3D SPI) device allows for great convenience and accuracy for our customers.
Existing 3D image expresses the height as a color map.
However, the color 3D solder paste inspection (Color 3D SPI) connects 2D colored images with 3D measuring data to provide detailed and accurate 3D color images, making the operation of equipment much easier.
Features and Benefits
● Dual Projection
Combination of 2D & 3D inspection eliminates common shadowproblem with SPI systems.
● 64 bit Windows 7 Operation System
Fast & Stable Operating System for high density PCB.
● User Friendly Graphical InterfaceSe
lf-developed Gerber Editor controls the main functions on one page which means it’s eliminating the effort of switching between multiple screens. It is also possible to register or edit the data quickly and easily by any users.
● Color 3D SPI
Conventional SPI methods could only calculate heights above silk print levels, but by using patented color enhancing algorithm TROI? could overcome these problems.
In addition, a fully rotational 3D view of the solder form is displayed.
This enables users to view a “life like’ image of the pad eliminating the need to extract the board from the line to view the defect under a microscope.